Electronic Encapsulant

Description

NEPEAN Electronic Encapsulant is a two component, low viscosity silicone rubber for insulative potting and encapsulation in electronic applications. After mixing the two components, the material cures upon exposure to moisture in the air at room temperature. ZS-GF-5299Z is easy to use and provides a long term reliable solution for the encapsulation of flit plugs for use in the mining industry and other encapsulation requirements in many industrial applications.

Features

Conforms to the following standards
- AS 1147.1-1989, Part 1
- AS/NZS 60079.18:2005, Encapulation ‘m’
- AS/NZS 60079.0:2005, General Requirements
Non-Flammable catalyst
Low viscosity allows for good flow and penetration
Repairable by cutting away and pouring new material
Protects against dust and dirt, and helps minimise the risk of arcing
Curable at room temperatures in 24 hours, depending on ambient conditions
Flexibility of cured material helps absorb cable movement, and contributes to connection integrity
Retains elastometric properties from -60°C to +224°C continuous
This product does not produce any byproduct during the curing reaction, complied with the RoHS, REACH of EU directivePart A & Part B differing colours ensure a colour change on mixing, which allows confirmation without streaks